Traditionally, assemblies of materials are carried out in a specific manner (nails, screws, rivets, etc.), linear (weld bead, line of glue...) or, at best, surface (sintering, glue surface, electro-welding...) These assembly methods are, in fact, sensitive to tearing and/or peeling.

The process Modulation’ allows three-dimensional assembly by deep and decreasing interpenetration. In this way, even materials of different natures find themselves intimately intertwined and the tearing forces which are exerted on the assembly thus constituted become intertwined. are distributed, no longer on a point, a line or even a surface, but throughout an entire volume.